Spectra™ FOUP

Overview The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and low cost of ownership for your facility.

Features

• Industry-proven door for equipment interoperability and long life

• Wafer supports integral with shell give excellent wafer plane performance and reliable wafer access

• Accurate equipment interfaces
  – Top robotic flange
  – Bottom kinematic coupling

• Ergonomic side handles for manual handling

• Unsurpassed cleanability and dryability

• Effective ESD path-to-ground

• ESD shell option provides added protection for wafers

• Purge capable

• High-strength assembly

• Wafers retained against shock and vibration

• Meets all applicable SEMI standards

Specifications

Overall Size/Weight

• Width: 416 mm (16.4")

• Depth: 333 mm (13.1")

• Height: 335 mm (13.2")

• Weight (empty): 4.2 kg (9.26 lb)
  (with wafers): 7.3 kg (16.09 lb)

Materials of Construction

• Ultrapure polycarbonate used in the FOUP shell, door housing and door panels 

• STAT-PRO^® 3000 carbon-filled PEEK™ material used in wafer contact areas in the shell and wafer retainer

• STAT-PRO^® 500 carbon-filled polycarbonate used in the ESD FOUP shell, door housing, door components

• Ultrapure thermoplastic elastomer (TPE) material used in the critical door seal

Configuration Options and Accessories

Color Options

• Color options on shell and door

• Four color options available: red, green, amber and clear

Configuration Options

• Info pads configurable by customer

Identification Options

• Cardholders

• Color handle inserts

• Bar code adhesive labels

• RFID molded-in or RFID pill

Ordering Information

These standard part numbers include a rear bracket and RFID pill in bottom horizontal position.